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 STGP3NB60M - STGD3NB60M
N-CHANNEL 3A - 600V TO-220 / DPAK PowerMESHTM IGBT
TYPE STGP3NB60M STGD3NB60M
s s s s s s s
VCES 600 V 600 V
VCE(sat) (Max) @25C < 1.9 V < 1.9 V
IC @100C 3A 3A
3
3 1 2
HIGH INPUT IMPEDANCE LOW ON-VOLTAGE DROP (Vcesat) OFF LOSSES INCLUDE TAIL CURRENT LOW GATE CHARGE HIGH CURRENT CAPABILITY HIGH FREQUENCY OPERATION CO-PACKAGED WITH TURBOSWITCHTM ANTIPARALLEL DIODE
1
TO-220
DPAK
DESCRIPTION Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESHTM IGBTs, with outstanding perfomances. The suffix "M" identifies a family optimized to achieve very low switching switching times for high frequency applications (<20KHZ)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS MOTOR CONTROLS s SMPS AND PFC AND BOTH HARD SWITCH AND RESONANT TOPOLOGIES
s
ORDERING INFORMATION
SALES TYPE STGP3NB60M STGD3NB60MT4 MARKING GP3NB60M GD3NB60M PACKAGE TO-220 DPAK PACKAGING TUBE TAPE & REEL
June 2003
1/11
STGP3NB60M - STGD3NB60M
ABSOLUTE MAXIMUM RATINGS
Symbol VCES VGE IC IC ICM ( ) PTOT Tstg Tj Parameter TO-220 Collector-Emitter Voltage (VGS = 0) Gate-Emitter Voltage Collector Current (continuous) at TC = 25C Collector Current (continuous) at TC = 100C Collector Current (pulsed) Total Dissipation at TC = 25C Derating Factor Storage Temperature Max. Operating Junction Temperature 68 0.55 - 55 to 150 150 600 20 6 3 24 60 0.47 Value DPAK V V A A A W W/C C C Unit
( ) Pulse width limited by safe operating area
THERMAL DATA
TO-220 Rthj-case Rthj-amb Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max 1.8 62.5 DPAK 2.1 100 C/W C/W
ELECTRICAL CHARACTERISTICS (TCASE = 25 C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions IC = 250 A, VGE = 0 VCE = Max Rating, TC = 25 C VCE = Max Rating, TC = 125 C VGE = 20V , VCE = 0 Min. 600 50 100 100 Typ. Max. Unit V A A nA VBR(CES) Collector-Emitter Breakdown Voltage ICES IGES Collector cut-off (VGE = 0) Gate-Emitter Leakage Current (VCE = 0)
ON (1)
Symbol VGE(th) VCE(sat) Parameter Gate Threshold Voltage Collector-Emitter Saturation Voltage Test Conditions VCE = VGE, IC = 250 A VGE = 15V, IC = 3 A VGE = 15V, IC= 3 A, Tj =125C Min. 3 1.5 1.2 Typ. Max. 5 1.9 Unit V V V
2/11
STGP3NB60M - STGD3NB60M
ELECTRICAL CHARACTERISTICS (CONTINUED) DYNAMIC
Symbol gfs (1) Cies Coes Cres Qg Qge Qgc ICL Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Latching Current VCE = 480V, IC = 3 A, VGE = 15V Vclamp = 480 V, VGE = 15V Tj = 125C , RG = 10 Test Conditions VCE = 15 V, Ic = 3 A VCE = 25V, f = 1 MHz, VGE = 0 Min. Typ. 5 240 33 6 15 2.2 8 20 20 Max. Unit S pF pF pF nC nC nC A
SWITCHING ON
Symbol td(on) tr (di/dt)on Eon Parameter Turn-on Delay Time Rise Time Turn-on Current Slope Turn-on Switching Losses Test Conditions VCC = 480 V, IC = 3A, RG = 10 , VGE = 15 V VCC= 480 V, IC = 3 A RG=10 VGE = 15 V,Tj =125C Min. Typ. 10 4 570 30 Max. Unit ns ns A/s J
SWITCHING OFF
Symbol tc tr(Voff) td(off) tf Eoff(**) Ets tc tr(Voff) td(off) tf Eoff(**) Ets Parameter Cross-over Time Off Voltage Rise Time Delay Time Fall Time Turn-off Switching Loss Total Switching Loss Cross-over Time Off Voltage Rise Time Delay Time Fall Time Turn-off Switching Loss Total Switching Loss Vcc = 480 V, IC = 3 A, RG = 10 , VGE = 15 V Tj = 125 C Test Conditions Vcc = 480 V, IC = 3 A, RG = 10 , VGE = 15 V Min. Typ. 330 85 120 240 175 205 810 270 344 515 458 488 Max. Unit ns ns ns ns
J J
ns ns ns ns
J J
Note: 1. Pulsed: Pulse duration = 300 s, duty cycle 1.5 %. 2. Pulse width limited by max. junction temperature. (**)Losses include Also the Tail (Jedec Standardization)
3/11
STGP3NB60M - STGD3NB60M
Output Characteristics Transfer Characteristics
Transconductance
Normalized Collector-Emitter On Voltage vs Temp.
Collector-Emitter On Voltage vs Collector Current Collector-Emitter On Voltage vs Temperature
4/11
STGP3NB60M - STGD3NB60M
Gate Threshold vs Temperature Normalized Breakdown Voltage vs Temperature
Capacitance Variations
Gate Charge vs Gate-Emitter Voltage
Total Switching Losses vs Gate Resistance
Total Switching Losses vs Temperature
5/11
STGP3NB60M - STGD3NB60M
Total Switching Losses vs Collector Current Thermal Impedance for TO-220
Thermal Impedance for DPAK
Turn-Off SOA
6/11
STGP3NB60M - STGD3NB60M
Fig. 1: Gate Charge test Circuit Fig. 2: Test Circuit For Inductive Load Switching
7/11
STGP3NB60M - STGD3NB60M
TO-220 MECHANICAL DATA
mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154
DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 oP Q
8/11
STGP3NB60M - STGD3NB60M
TO-252 (DPAK) MECHANICAL DATA
mm MIN. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0
o
DIM. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
inch MAX. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 MIN. 0.087 0.035 0.001 0.025 0.204 0.018 0.019 0.236 0.252 0.173 0.368 0.031 1.00 8
o
TYP.
TYP.
MAX. 0.094 0.043 0.009 0.035 0.213 0.024 0.024 0.244 0.260 0.181 0.398
0.8 0.024 0
o
0.039 0o
P032P_B
9/11
STGP3NB60M - STGD3NB60M
DPAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
All dimensions are in millimeters
All dimensions are in millimeters
TAPE AND REEL SHIPMENT (suffix "T4")*
REEL MECHANICAL DATA
DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W
10/11
BASE QTY 2500
mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 1.85 7.6 2.75 4.1 8.1 2.1
16.3
inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618
0.641
MAX. 10.6 12.1 1.6
* on sales type
STGP3NB60M - STGD3NB60M
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. (c) http://www.st.com
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